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d a t a sh eet product speci?cation supersedes data of 1995 may 03 file under integrated circuits, ic12 1997 mar 28 integrated circuits PCF21XXC family lcd drivers
1997 mar 28 2 philips semiconductors product speci?cation lcd drivers PCF21XXC family contents 1 features 2 general description 3 quick reference data 4 ordering information 5 block diagrams 6 pinning 6.1 pcf2100c 6.2 pcf2111c 6.3 pcf2112c 7 functional description 7.1 pcf2100c 7.2 pcf2111c 7.3 pcf2112c 7.4 bus control logic 7.5 timing 7.6 input circuitry 7.7 expansion 8 limiting values 9 handling 10 dc characteristics 11 ac characteristics 12 package outlines 13 soldering 13.1 plastic dual in-line packages 13.1.1 by dip or wave 13.1.2 repairing soldered joints 13.2 plastic small outline packages 13.2.1 by wave 13.2.2 by solder paste reflow 13.2.3 repairing soldered joints (by hand-held soldering iron or pulse-heated solder tool) 14 definitions 15 life support applications
1997 mar 28 3 philips semiconductors product speci?cation lcd drivers PCF21XXC family 1 features supply voltage 2.25 to 6.0 v low current consumption serial data input cbus control one-point built-in oscillator stand-alone or expanded system power-on reset clear lcd segments C 40 (pcf2100c) C 64 (pcf2111c) C 32 (pcf2112c) multiplex rate C 1 : 2 (pcf2100c) C 1 : 2 (pcf2111c) C 1 : 1 (pcf2112c) word length C 22 bits (pcf2100c) C 34 bits (pcf2111c) C 34 bits (pcf2112c). 2 general description the PCF21XXC family are single-chip, silicon gate cmos lcd driver circuits. a 3-line bus (cbus) structure enables serial data transfer with microcontrollers. all inputs are cmos/nmos compatible. the devices have the same function and performance as those of the pcf21xx family, which they supersede. the maximum operating voltage required is reduced from 6.5 to 6.0 v. 3 quick reference data 4 ordering information symbol parameter conditions min. typ. max. unit v dd supply voltage 2.25 - 6.0 v i dd1 supply current 1 outputs open; cbus inactive - 20 50 m a i dd2 supply current 2 outputs open; cbus inactive; t amb =25 c - 20 30 m a p o power dissipation per output -- 100 mw t amb operating ambient temperature - 40 - +85 c t stg storage temperature - 65 - +150 c type number package name description version pcf2100cp dip28 plastic dual in-line package; 28 leads (600 mil) sot117-1 pcf2100ct so28 plastic small outline package; 28 leads; body width 7.5 mm sot136-1 pcf2111cp dip40 plastic dual in-line package; 40 leads (600 mil) sot129-1 pcf2111ct vso40 plastic very small outline package; 40 leads sot158-1 pcf2112cp dip40 plastic dual in-line package; 40 leads (600 mil) sot129-1 pcf2112ct vso40 plastic very small outline package; 40 leads sot158-1
1997 mar 28 4 philips semiconductors product speci?cation lcd drivers PCF21XXC family 5 block diagrams fig.1 block diagram; pcf2100c. handbook, full pagewidth backplane and segment drivers analog voltage bus control shift register latches and driver control oscillator and divider 40-segment lcd bp2 bp1 25 26 s1 to s20 24 to 5 2 3 4 dlen clb data v ss v dd osc 680 pf 1 m w r o c o a b 28 1 27 mld286 pcf2100c fig.2 block diagram; pcf2111c. handbook, full pagewidth backplane and segment drivers analog voltage bus control shift register latches and driver control oscillator and divider 64-segment lcd bp2 bp1 37 38 2 3 4 dlen clb data v ss v dd osc 680 pf 1 m w r o c o a b 40 1 39 mld285 pcf2111c s1 to s32 36 to 5
1997 mar 28 5 philips semiconductors product speci?cation lcd drivers PCF21XXC family fig.3 block diagram; pcf2112c. handbook, full pagewidth backplane and segment drivers analog voltage bus control shift register latches and driver control oscillator and divider 32-segment lcd bp 38 2 3 4 dlen clb data v ss v dd osc 1.5 nf 1 m w r o c o 40 1 39 mld287 pcf2112c s1 to s32 36 to 5
1997 mar 28 6 philips semiconductors product speci?cation lcd drivers PCF21XXC family 6 pinning 6.1 pcf2100c symbol pin description clb 1 clock burst input (cbus) v dd 2 supply voltage osc 3 oscillator input v ss 4 supply voltage ground s20 5 lcd driver output 20 s19 6 lcd driver output 19 s18 7 lcd driver output 18 s17 8 lcd driver output 17 s16 9 lcd driver output 16 s15 10 lcd driver output 15 s14 11 lcd driver output 14 s13 12 lcd driver output 13 s12 13 lcd driver output 12 s11 14 lcd driver output 11 s10 15 lcd driver output 10 s9 16 lcd driver output 9 s8 17 lcd driver output 8 s7 18 lcd driver output 7 s6 19 lcd driver output 6 s5 20 lcd driver output 5 s4 21 lcd driver output 4 s3 22 lcd driver output 3 s2 23 lcd driver output 2 s1 24 lcd driver output 1 bp2 25 backplane driver output 2 bp1 26 backplane driver output 1 data 27 data input line (cbus) dlen 28 data input line enable (cbus) fig.4 pin configuration; sot117-1 and sot136-1. handbook, halfpage pcf2100c mld295 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 clb v osc s20 s19 s18 s17 s16 s15 s14 s13 s12 s11 dd v ss dlen data bp1 bp2 s1 s2 s3 s4 s5 s6 s7 s8 s9 s10
1997 mar 28 7 philips semiconductors product speci?cation lcd drivers PCF21XXC family 6.2 pcf2111c symbol pin description clb 1 clock burst input (cbus) v dd 2 supply voltage osc 3 oscillator input v ss 4 supply voltage ground s32 5 lcd driver output 32 s31 6 lcd driver output 31 s30 7 lcd driver output 30 s29 8 lcd driver output 29 s28 9 lcd driver output 28 s27 10 lcd driver output 27 s26 11 lcd driver output 26 s25 12 lcd driver output 25 s24 13 lcd driver output 24 s23 14 lcd driver output 23 s22 15 lcd driver output 22 s21 16 lcd driver output 21 s20 17 lcd driver output 20 s19 18 lcd driver output 19 s18 19 lcd driver output 18 s17 20 lcd driver output 17 s16 21 lcd driver output 16 s15 22 lcd driver output 15 s14 23 lcd driver output 14 s13 24 lcd driver output 13 s12 25 lcd driver output 12 s11 26 lcd driver output 11 s10 27 lcd driver output 10 s9 28 lcd driver output 9 s8 29 lcd driver output 8 s7 30 lcd driver output 7 s6 31 lcd driver output 6 s5 32 lcd driver output 5 s4 33 lcd driver output 4 s3 34 lcd driver output 3 s2 35 lcd driver output 2 s1 36 lcd driver output 1 bp2 37 backplane driver output 2 bp1 38 backplane driver output 1 data 39 data input line (cbus) dlen 40 data input line enable (cbus) fig.5 pin configuration; sot129-1 and sot158-1. handbook, halfpage pcf2111c mld291 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 clb v osc s32 s31 s30 s29 s28 s27 s26 s25 s24 s23 s22 s21 s20 s19 s18 s17 dd v ss dlen bp1 s1 s2 s3 s4 s5 s6 s7 s8 s9 s10 s11 s12 s13 s14 s15 s16 data bp2
1997 mar 28 8 philips semiconductors product speci?cation lcd drivers PCF21XXC family 6.3 pcf2112c symbol pin description clb 1 clock burst input (cbus) v dd 2 supply voltage osc 3 oscillator input v ss 4 supply voltage ground s32 5 lcd driver output 32 s31 6 lcd driver output 31 s30 7 lcd driver output 30 s29 8 lcd driver output 29 s28 9 lcd driver output 28 s27 10 lcd driver output 27 s26 11 lcd driver output 26 s25 12 lcd driver output 25 s24 13 lcd driver output 24 s23 14 lcd driver output 23 s22 15 lcd driver output 22 s21 16 lcd driver output 21 s20 17 lcd driver output 20 s19 18 lcd driver output 19 s18 19 lcd driver output 18 s17 20 lcd driver output 17 s16 21 lcd driver output 16 s15 22 lcd driver output 15 s14 23 lcd driver output 14 s13 24 lcd driver output 13 s12 25 lcd driver output 12 s11 26 lcd driver output 11 s10 27 lcd driver output 10 s9 28 lcd driver output 9 s8 29 lcd driver output 8 s7 30 lcd driver output 7 s6 31 lcd driver output 6 s5 32 lcd driver output 5 s4 33 lcd driver output 4 s3 34 lcd driver output 3 s2 35 lcd driver output 2 s1 36 lcd driver output 1 n.c. 37 not connected bp 38 backplane driver output data 39 data input line (cbus) dlen 40 data input line enable (cbus) fig.6 pin configuration; sot129-1 and sot158-1. handbook, halfpage pcf2112c mld292 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 clb v osc s32 s31 s30 s29 s28 s27 s26 s25 s24 s23 s22 s21 s20 s19 s18 s17 dd v ss dlen bp s1 s2 s3 s4 s5 s6 s7 s8 s9 s10 s11 s12 s13 s14 s15 s16 data n.c.
1997 mar 28 9 philips semiconductors product speci?cation lcd drivers PCF21XXC family 7 functional description an lcd segment or led output is activated when the corresponding data bit is high. 7.1 pcf2100c when data bit 21 is high, the a-latches (bp1) are loaded. with data bit 21 low, the b-latches (bp2) are loaded. clb pulse 23 transfers data from the shift register to the selected latches. 7.2 pcf2111c when data bit 33 is high, the a-latches (bp1) are loaded. with data bit 33 low, the b-latches (bp2) are loaded. clb pulse 35 transfers data from the shift register to the selected latches. 7.3 pcf2112c when data bit 33 is high, the latches are loaded. clb pulse 35 transfers data from the shift register to the selected latches. 7.4 bus control logic the following tests are carried out by the bus control logic: 1. test on leading zero 2. test on number of data bits 3. test of disturbed dlen and data signals during transmission. if one of the test conditions is not fulfilled, no action follows the load condition (load pulse with dlen low) and the driver is ready to receive new data. fig.7 cbus data format. handbook, full pagewidth dlen clb data 1 01 s1 1 s1 2 s2 2 s2 3 s3 3 s3 4 s4 4 s4 5 s5 5 s5 6 s6 6 s6 7 s7 7 s7 31 s31 19 s19 23 4 5 678 32 20 33 21 34 22 35 23 pcf2111c and pcf2112c pcf2100c pcf2111c and pcf2112c load bit load pulse leading zero test leading zero 32 s32 20 s20 33 21 pcf2100c bit number output mld296
1997 mar 28 10 philips semiconductors product speci?cation lcd drivers PCF21XXC family 7.5 timing fig.8 timing diagram for pcf2100c and pcf2111c. mld294 v dd v ss ss dd 0.5 (v v ) ss dd 0.5 (v v ) v dd v ss ss dd 0.5 (v v ) v dd v ss ss dd v v 0 ss dd 0.5 (v v ) ss dd (v v ) ss dd 0.5 (v v ) ss dd v v 0 ss dd 0.5 (v v ) ss dd (v v ) bp2 sx bp1 sx bp1 bp2 sx 1 f lcd off / off on / off off / on on / on fig.9 timing diagram for pcf2112c. handbook, halfpage mld299 v dd v ss v dd v ss ss dd v v 0 ss dd (v v ) bp sx segment x (sx) bp 1 f lcd off on
1997 mar 28 11 philips semiconductors product speci?cation lcd drivers PCF21XXC family 7.6 input circuitry 7.7 expansion fig.10 input circuitry. v ss line is common. in systems where it is expected that v dd2 >v dd1 + 0.5 v, a resistor should be inserted to reduce the current flowing through the input protection. maximum input current 40 m a. handbook, halfpage bus driver PCF21XXC r 100 k w v ss v dd2 v dd v ss mld284 fig.11 expansion possibility (using pcf2111c). by connecting osc to v ss the bp pins become inputs and generate signals synchronized to the single oscillator frequency, thus allowing expansion of several members of the PCF21XXC family up to the bp drive capability of the master. the pcf2112c can only function as a master for other pcf2112cs. handbook, full pagewidth dlen osc clb data bp2 s1 to s32 bp1 v ss pcf2111c slave1 dlen osc clb data bp2 s1 to s32 bp1 v ss pcf2111c slave1 dlen osc clb data bp2 s1 to s32 bp1 v ss v dd pcf2111c master lcd mld293 data clb dlen1 dlen2 dlen3
1997 mar 28 12 philips semiconductors product speci?cation lcd drivers PCF21XXC family 8 limiting values in accordance with the absolute maximum rating system (iec 134). note 1. derate by 7.7 mw/k when t amb >60 c. 9 handling inputs and outputs are protected against electrostatic discharge in normal handling. however, to be totally safe, it is desirable to take normal precautions appropriate to handling mos devices. see handling mos devices . esd in accordance with mil std 883c, method 3015 . symbol parameter conditions min. max. unit v dd supply voltage - 0.5 +8.0 v v i input voltage dlen, clb, data and osc v ss - 0.5 v dd + 0.5 v v o output voltage bp1, bp2 and s1 to s32 v ss - 0.5 v dd + 0.5 v i dd , i ss supply current - 50 +50 ma i i dc input current - 20 +20 ma i o dc output current - 25 +25 ma p tot total power dissipation per package note 1 - 500 mw p o power dissipation per output - 100 mw t stg storage temperature - 65 +150 c
1997 mar 28 13 philips semiconductors product speci?cation lcd drivers PCF21XXC family 10 dc characteristics v dd = 2.25 to 6.0 v; v ss =0v; t amb = - 40 to +80 c; r o =1m w ; c o = 680 pf; unless otherwise speci?ed. notes 1. outputs open; cbus inactive. 2. resets all logic, when v dd 1997 mar 28 14 philips semiconductors product speci?cation lcd drivers PCF21XXC family 11 ac characteristics v dd = 2.25 to 6.0 v; v ss =0v; t amb = - 40 to +80 c; r o =1m w ; c o = 680 pf; all timing values are referenced to v ih and v il levels with an input voltage swing of v ss to v dd ; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit inputs clb, data and dlen (see fig.12) t suda data set-up time 3 --m s t hdda data hold time 3 --m s t suen enable set-up time 1 --m s t sudi disable set-up time 2 --m s t suld load pulse set-up time 2.5 --m s t busy busy time 3 --m s t wh clb high time 1 --m s t wl clb low time 5 --m s t clb clb cycle time 10 --m s t r rise time -- 10 m s t f fall time -- 10 m s lcd timing (see figs. 12, 14, 15, 16 and 17) f lcd lcd frame frequency pcf2100c, pcf2111c 60 75 100 hz pcf2112c c o = 1.5 nf 30 35 50 hz t bs transfer time with test loads v dd =5v - 20 100 m s t plcd driver delay time with test loads v dd =5v - 20 100 m s
1997 mar 28 15 philips semiconductors product speci?cation lcd drivers PCF21XXC family handbook, full pagewidth mld297 bp1, bp2 (except pcf 2112c) (v = 5 v) dd 0.5 v bs t clb t sx v dd 2 0.5 v (v = 5 v) dd 0.5 v 0.5 v 0.5 v 0.5 v (v = 5 v) dd enable disable v il max v il max v il max v il max v ih min v ih min v ih min v ih min v ih min v il max dlen t r t r t f t f t hdda t suda t suen t suda t sudi t suld t busy t pcld t hdda t wh t wl t wl leading zero data s1 load bit load pulse 12 22 34 23 (1) 35 (2) bp (pcf2112c) clb data fig.12 cbus timing. (1) load pulse 23 for pcf2100c (see fig.7). (2) load pulse 35 for pcf2111c and pcf2112c (see fig.7).
1997 mar 28 16 philips semiconductors product speci?cation lcd drivers PCF21XXC family fig.13 supply current as a function of supply voltage. (1) t amb = - 40 c. (2) t amb = +85 c. (3) t amb = +25 c . handbook, halfpage 024 8 20 8 12 16 mld283 6 i dd ( m a) (1) (2) (3) typ dd v (v) fig.14 display frequency as a function of supply voltage; c o = 680 pf (except pcf2112c). (1) t amb = - 40 c. (2) t amb = +25 c. (3) t amb = +85 c . handbook, halfpage 024 8 80 70 78 mld282 6 76 74 72 v (v) dd f lcd (hz) typ (1) (2) (3) fig.15 display frequency as a function of supply voltage; c o = 1.5 nf (only pcf2112c). (1) t amb = - 40 c. (2) t amb = +25 c. (3) t amb = +85 c . handbook, halfpage 024 8 37 36 34 33 35 mld289 6 f lcd (hz) typ (1) (2) (3) dd v (v) fig.16 display frequency as a function of r o and c o ; t amb =25 c; v dd =5v. (1) r o =1m w . (2) r o = 100 k w . handbook, halfpage 10 mld281 1 10 1 10 10 3 10 2 c (nf) o f lcd (hz) typ (1) (2)
1997 mar 28 17 philips semiconductors product speci?cation lcd drivers PCF21XXC family fig.17 test loads. handbook, halfpage mld298 s1 to s32 bp (pcf2112c), bp1, bp2 i = 15 m a l i = 25 m a l fig.18 output resistance of backplane and segments. (1) t amb = +85 c. (2) t amb = +25 c. (3) t amb = - 40 c . handbook, halfpage 024 8 2 1.5 0.5 0 1 mld288 6 r o (k w) dd v (v) typ (1) (2) (3) (1) (2) (3) r s r bp fig.19 low level output current as a function of supply voltage (only pcf2112c). (1) t amb = - 40 c. (2) t amb = +25 c. (3) t amb = +85 c . handbook, halfpage 024 8 18 8 16 mld290 6 14 12 10 v (v) dd i ol (ma) typ (1) (2) (3)
1997 mar 28 18 philips semiconductors product speci?cation lcd drivers PCF21XXC family 12 package outlines unit a max. 1 2 b 1 (1) (1) (1) cd e w em h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot117-1 92-11-17 95-01-14 a min. a max. b z max. m e e 1 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 3.9 3.4 0.25 2.54 15.24 15.80 15.24 17.15 15.90 1.7 5.1 0.51 4.0 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.15 0.13 0.01 0.10 0.60 0.62 0.60 0.68 0.63 0.067 0.20 0.020 0.16 051g05 mo-015ah m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 28 1 15 14 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. handbook, full pagewidth dip28: plastic dual in-line package; 28 leads (600 mil) sot117-1
1997 mar 28 19 philips semiconductors product speci?cation lcd drivers PCF21XXC family unit a max. 1 2 b 1 cd e e m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot129-1 92-11-17 95-01-14 a min. a max. b z max. w m e e 1 1.70 1.14 0.53 0.38 0.36 0.23 52.50 51.50 14.1 13.7 3.60 3.05 0.254 2.54 15.24 15.80 15.24 17.42 15.90 2.25 4.7 0.51 4.0 0.067 0.045 0.021 0.015 0.014 0.009 2.067 2.028 0.56 0.54 0.14 0.12 0.01 0.10 0.60 0.62 0.60 0.69 0.63 0.089 0.19 0.020 0.16 051g08 mo-015aj m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 40 1 21 20 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) (1) dip40: plastic dual in-line package; 40 leads (600 mil) sot129-1
1997 mar 28 20 philips semiconductors product speci?cation lcd drivers PCF21XXC family unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot136-1 91-08-13 95-01-24 x 14 28 w m q a a 1 a 2 b p d h e l p q detail x e z c l v m a e 15 1 (a ) 3 a y 0.25 075e06 ms-013ae pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.42 0.39 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale so28: plastic small outline package; 28 leads; body width 7.5 mm sot136-1
1997 mar 28 21 philips semiconductors product speci?cation lcd drivers PCF21XXC family unit a 1 a 2 a 3 b p cd (1) e (2) z (1) eh e ll p qy w v q references outline version european projection issue date iec jedec eiaj mm inches 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 2.25 12.3 11.8 1.15 1.05 0.6 0.3 7 0 o o 0.1 0.1 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 1.7 1.5 sot158-1 92-11-17 95-01-24 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a y 40 20 21 1 pin 1 index 0.012 0.004 0.096 0.089 0.017 0.012 0.0087 0.0055 0.61 0.60 0.30 0.29 0.03 0.089 0.48 0.46 0.045 0.041 0.024 0.012 0.004 0.2 0.008 0.004 0.067 0.059 0.010 0 5 10 mm scale vso40: plastic very small outline package; 40 leads sot158-1 a max. 2.70 0.11
1997 mar 28 22 philips semiconductors product speci?cation lcd drivers PCF21XXC family 13 soldering 13.1 introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). 13.2 dip 13.2.1 s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. 13.3 so and vso 13.3.1 r eflow soldering reflow soldering techniques are suitable for all so and vso packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. 13.3.2 w ave soldering wave soldering techniques can be used for all so and vso packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.3.3 r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1997 mar 28 23 philips semiconductors product speci?cation lcd drivers PCF21XXC family 14 definitions 15 life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. short-form speci?cation the data in this speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
internet: http://www.semiconductors.philips.com philips semiconductors C a worldwide company ? philips electronics n.v. 1997 sca53 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 1231, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: rua do rocio 220, 5th floor, suite 51, 04552-903 s?o paulo, s?o paulo - sp, brazil, tel. +55 11 821 2333, fax. +55 11 829 1849 spain: balmes 22, 08007 barcelona, tel. +34 3 301 6312, fax. +34 3 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 632 2000, fax. +46 8 632 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2686, fax. +41 1 481 7730 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2870, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 625 344, fax.+381 11 635 777 for all other countries apply to: philips semiconductors, marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 200 733, fax. +375 172 200 773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 689 211, fax. +359 2 689 102 canada: philips semiconductors/components, tel. +1 800 234 7381 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. +45 32 88 2636, fax. +45 31 57 1949 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615800, fax. +358 9 61580/xxx france: 4 rue du port-aux-vins, bp317, 92156 suresnes cedex, tel. +33 1 40 99 6161, fax. +33 1 40 99 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 23 53 60, fax. +49 40 23 536 300 greece: no. 15, 25th march street, gr 17778 tavros/athens, tel. +30 1 4894 339/239, fax. +30 1 4814 240 hungary: see austria india: philips india ltd, shivsagar estate, a block, dr. annie besant rd. worli, mumbai 400 018, tel. +91 22 4938 541, fax. +91 22 4938 722 indonesia: see singapore ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381 middle east: see italy printed in the netherlands 417067/1200/02/pp24 date of release: 1997 mar 28 document order number: 9397 750 01649

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